5

Structural and chemical stability of Ta–Si–N thin film between Si and Cu

Année:
1998
Langue:
english
Fichier:
PDF, 604 KB
english, 1998
6

Properties of reactively sputtered WNx as Cu diffusion barrier

Année:
1999
Langue:
english
Fichier:
PDF, 569 KB
english, 1999